Product Advantages

可自定义各类AI识别场景 SDK完备且API丰富
创新架构
自研边缘端加速硬件,集成2D/红外探测异构芯片 高效算力,实时处理双光谱数据,应对复杂场景
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功能配置
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主流工业协议对接
双光高精成像
融合 dToF 与可见光双重成像 点云精度高,精准还原复杂场景三维细节
完备软件工具链
支持自定义三维空间异物入侵、异常轨迹检测 适配多样化场景,提供完善SDK
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Product Specs

Pixel Count
4M
Resolution
2560(H) × 1440(V)
RGB Capture Frame Rate
90FPS
Voltage
DC 24V
Working Current
1A
Operating Temperature
-20℃-50℃
TOF Resolution
640×480/320×240
TOF Field of View
64° x 50° or 98° x 80°
Range
0.2 ~ 12m@10% Reflectivity/0.2 ~8m@10% Reflectivity
Accuracy
1%@Full Range
Wavelength
940nm
Certification
CE/FCC

Use Cases

behavior analysis understanding

behavior analysis understanding

Real-time alarm and short video recording for operations violating SOP

Automatic identification and statistics of SOP step man-hours and beats

Instantly detect problems such as missing, doing more, wrong and improper sequence of assembly actions of personnel.

Lean production management, improve product quality, optimize production efficiency

Distributed Architecture, Centralized Management, Integrated Platform for Enterprise Action Analysis

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Contact us and look forward to your consultation

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